Ge diced wafers

Thin rectangular plates of germanium

Part details

Material :

Single cristal Germanium

Cristal orientation :

<111> +/- 0.2°

Manufacturing process :

Material growing, slicing and polishing LINDE A quality on both surfaces of wafer discs, final dicing in rectangular shape.

Dimensions:

40×29.7 mm +/- 0.1mm

Thickness : 1 mm +/- 25 µm

Shape :

Rectangular plate

Optical treatment :

None

Usage :

Monochromator in XRF spectromoters for quality control inspection.

Remark :

Export of Germanium from China need to go through export licence request to Chinese authorities, SINOPTIX can apply for this licence, please see details on our article on export of Germanium from China.