Diced wafer

Thin plates of material diced in custom rectangular cuts.

Part details

Material :

sapphire purity 99.998%

Manufacturing process :

Mechanical cutting of sapphire wafers.

Dimensions:

Thickness 500µm (0.5mm  +/- 0.03mm)

Length 15mm, width 8mm  (can be customized)

Shape :

Rectangular thin plate

Crystal orientation :

C-plane

Aspect :

Both sides polished, Ra below 0.3nm

Optical treatment :

None

Usage :

Biotechnology