Fused silica wafers

High quality wafer for semiconductors and industry

Material : Fused silica  (JGS1 & JGS2)

Process : cutting and one face polishing or double face polishing

Dimensions:  from diameter 1″ to 20″ ( 25.4mm to 500 mm) +/- 0.05mm

Thickness : 400 µm to 1mm +/- 0.01mm

Shape : round with a flat cut. Can be custom diced.

Surface quality : RMS better than 5 nm

TTV : less than 20 µm

Aspect  : scratch and ditch 20/10

Usage : semiconductors and  industry