FZ Silicon wafer

High purity Si wafer for semiconductor industry

Material : Float Zone method grown silicon crystal  – FZ Si

Process : cutting and one face polishing or double face polishing

Dimensions:  from diameter 1″ to 12″ ( 25.4mm to 304.8 mm)

Thickness : 25µm to 1mm

Shape : round with a flat cut. Can be custom diced.

Types : P-type, N-Type, Semi-insulating

Surface quality : Ra better than 0.2 nm

Surface coating : Nitride film, Oxide film or metal coating (Au, Ag, Pr, Cu, Ti, Ni..)

Orientation : <100>, <111>, <110>

TTV : lower than 10 µm or lower than 5 µm or lower than 3 µm

Bow : better than 20 µm for wafers up to 5″, better than 50 µm for 12″ wafers

Resistivity : 1 Ohm.cm to 100,000 Ohm.cm

Usage : semiconductor industry