Germanium wafers

High quality wafer for electronics and opto-electronic industry

Material : Mono crystalline Germanium | Ge

Process : cutting and one face polishing or double face polishing

Dimensions:  from diameter 1″ to 6″ ( 25.4mm to 152.4 mm)

Thickness : 25µm to 1mm

Shape : round with a flat cut. Can be custom diced.

Types : P-type, N-Type, undoped

Orientation : <100>, <111>, <110>

TTV : less than 10 µm

Bow : better than 25 µm

Resistivity : 5 mOhm.cm to 50 Ohm.cm

Usage : semiconductor industry