N-type silicon wafer

N-type silicon wafer

N-doped Si thin plate, both side polished

Part details

Material :

High resistivity N-type Silicon  FZ grown doped with Nitrogen

Resistivity 10 000 ohm.cm

Orientation : <111>

Manufacturing process :

  1. Crystal growing
  2. Cutting in thin plates
  3. Double side polishing
  4. Dicing

Dimensions:

10.5 mm x 10.5mm x 0.5 mm (500 µm)  –  Custom dimensions.

Shape :

Square thin plate

Optical treatment :

None

Usage :

Infrared window for stove security device’s sensor protection.

Don’t hesitate to review our guide on IR optics.